NVDA's H100 GPU Demand vs. Production Bottlenecks

It's interesting to see the continued narrative around $NVDA's H100 GPU demand. While backlog remains significant, the discussion often overlooks the fabrication constraints, specifically CoWoS packaging capacity at TSMC. The bottleneck isn't necessarily a lack of wafer starts but the subsequent advanced packaging. This impacts actual unit shipments and, consequently, revenue realization in the short to medium term. Are we overestimating $NVDA's ability to scale H100 deliveries given these known production limits, or do market participants believe TSMC will rapidly resolve this specific constraint within the next two quarters?